| 摘要 |
A heat absorbent device is comprised of a container filled with a phase change material selected to melt at about 75° F. It is arranged to be installed in a room with business critical electronics equipment that requires constant cooling by a cooling system, typically, to about 72° F. In some embodiments, the container is comprised of a container for attaching to a T-rail of a ceiling tile system. In another embodiment, the container is comprised of a container with hooks for attaching to holes on computer cabinets. In yet another embodiment, the container is comprised of a ceiling tile with a plurality of individually sealed cells containing the phase change material. In the event of a cooling system failure and rapidly rising room temperature, the phase change material will begin absorbing heat and cooling the room when the room temperature has reached its melting point. Without the heat absorbent device, an exemplar equipment room with about 35 W/ft2 heat production will reach an equipment failure temperature of 120° F. in about 15 minutes. With enough heat absorbent devices providing about 500 ml/ft2 of a 430 J/ml phase change material, temperature rise is slowed enough to delay equipment failure by an additional 50 minutes, which may be enough for repairing the cooling system or shutting down the equipment.
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