发明名称 SUPER ABRASIVE GRAIN CUTTING WHEEL
摘要 PROBLEM TO BE SOLVED: To improve wear resistance of a base plate, reduce a coefficient of friction and improve the cutting accuracy of a super abrasive grain cutting wheel manufactured by fixing the super abrasive grain to an outer periphery of a disc-shaped base plate made of molybdenum by a binder, by partially or totally coating an exposed surface of the base plate with a hard film. SOLUTION: This super abrasive grain cutting wheel used in the precise cutting.grooving work of the optical glass, a semiconductor material and the like, is manufactured by forming a super abrasive grain layer 2 by fixing the super abrasive grain to an outer periphery of a disc-shaped base plate 1 made of molybdenum, by a binder. On this occasion, an exposed surface of the base plate 1 is totally or partially coated with a hard film 4. As the hard film, a chrome plating of a thickness of 1-100μm, a TiN coating of a thickness of 1-50μm, a DLC(diamond-like carbon thin film) coating of a thickness of 1-10μm, and a CrN(chromium nitride) coating of a thickness of 1-50μm can be preferably used. As the binder, the resin bond, a metal bond and the like can be used.
申请公布号 JP2001001266(A) 申请公布日期 2001.01.09
申请号 JP19990246020 申请日期 1999.07.27
申请人 OSAKA DIAMOND IND CO LTD 发明人 INOUE HARUO;OKANISHI YUKIO;FUKUSHIMA KENJI
分类号 B24D3/00;B24D5/12;(IPC1-7):B24D3/00 主分类号 B24D3/00
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