发明名称 RESIN COMPOSITION AND INSULATING COATING FILM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition capable of exhibiting excellent heat resistance, mechanical characteristics, low absorption, etc., and forming an insulating coating film having an excellent low relative dielectric constant, etc. by making the composition include a copolymer having a specific constituent unit and an organic solvent. SOLUTION: This composition comprises (A) a copolymer having a constituent unit of the formula (R1 and R2 are each an alkyl, an aryl, an alkoxy, an aryloxy or the like; (m) and (n) are each 0-5; X a single bond, O, S, CO or the like; A is an arylene, a heteroarylene or the like; Z1 and Z2 are each a single bond or an arylene; and Y is O or the like) and (B) an organic solvent (e.g. methyl cellosolve, methyl ethyl ketone, N,N-dimethylformamide, etc.). The copolymer is obtained, for example, by subjecting a monomer of a quinoline and a diol monomer to polycondensation. The amount of the component B used is preferably an amount to make the concentration of the solid content of the component A 1-60 wt.%. The composition is applied to a substrate and dried to form an insulating coating film.
申请公布号 JP2001002995(A) 申请公布日期 2001.01.09
申请号 JP19990174813 申请日期 1999.06.22
申请人 HITACHI CHEM CO LTD 发明人 ABE KOICHI;OTA FUMIHIKO;TAKAYASU REIKO
分类号 C09D187/00;(IPC1-7):C09D187/00 主分类号 C09D187/00
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