发明名称 FLOOR PANEL
摘要 PROBLEM TO BE SOLVED: To provide a floor panel capable of increasing the connection strength of connection face between a joist and a thermal insulating material. SOLUTION: A joist is formed in a rectangular cross-section. A groove part 15 is provided in both side faces 12a of the joist with short side. These groove parts 15 are provided extendedly along the longitudinal direction of each joist and over the entire length of the joist 12. The groove parts 15 are formed in recessed shape, and their depth is set at a specified depth h1. A distance L3 between bottom surfaces 15a of the grooved parts 15 opposed to each other is set so as to be equal to the thickness h2 of the joist. Thus, in the joist, the cross-sectional shape (shape of portion shown by diagonal lines) of the portion of the groove part 15 excluding both side portions is generally formed in square. Whereas, a projected part 17 corresponding to the groove part 15 is provided on an inside face 16 of recessed parts 14a to 14c. The joist and thermal insulating material 13 are connected to each other in the state that the projected part 17 is fitted to the groove part 15.
申请公布号 JP2001003477(A) 申请公布日期 2001.01.09
申请号 JP19990172326 申请日期 1999.06.18
申请人 IBIDEN CO LTD 发明人 KATO YOSHIHIRO;NOMURA TOSHIHIRO
分类号 E04B1/80;E04B1/76;E04F15/00;E04F15/18;(IPC1-7):E04B1/80 主分类号 E04B1/80
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