| 摘要 |
PROBLEM TO BE SOLVED: To reduce the run-out of a wire and to improve the uniformity coefficient of a thickness of a wafer by displacing a plurality of works in the cutting feed direction to obtain the time difference in the cutting of each matter to be cut, in the initial period of the cutting work. SOLUTION: Three works 5 are respectively adhered to work plates 6 through adhesive materials 7 of different heights, and each work plate 6 is mechanically held on a feed part 9 through a mounting and holding mechanism 8. The dimensions of the adhesive material 7 are varied and the position thereof are shifted in the cutting feed direction so that the works 5 are successively contacted with a wire 4 from a left side when the feed part 9 is lowered. When the cutting feed is started, the work 5 at left side is contacted with the wire 4 to be cut first, the orbit of the wire 4 is stabilized by allowing the left work 5 to act as a wire guide, then a central work 5 is cut, and continuously a right work 5 is cut, whereby the unevenness in the thickness and the bowing of the wafer can be remarkably reduced. |
