PHOTO-SENSITIVE RESIN COMPOSITION, PRODUCTION OF POLYAMIC ACID DERIVATIVE, FORMATION OF POLYIMIDE FILM PATTERN AND ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To obtain a photo-sensitive resin composition which has improved resolution characteristics and adhesivity and can form polyimide film patterns having excellent resolution and residual film characteristics, by compounding a specific polyimide precursor and a photosensitive dissolution inhibitor. SOLUTION: This photo-sensitive resin composition comprises (A) a polyimide precursor comprising a polyamic acid derivative having repeating units of formula I (R1 is a tetravalent organic group; R2 is a divalent organic group; and R3, R4 are each a monovalent organic group or OH, provided that at least one of R3 and R4 is an organic group having two or more OH groups bound to aromatic rings) in the molecule and (B) a photosensitive dissolution inhibitor. The component A can be produced, for example, by a method comprising polymerizing (i) a diester dicarboxylic acid compound of formula II with (ii) a diamine compound of the formula: H2N-R2-NH2 in the presence of (iii) a dehydration- condensing agent. The composition is used for forming polyimide film patterns on electronic parts such as insulation members and liquid crystal element membranes.