发明名称 |
CONNECTION METHOD AND STRUCTURE OF METAL MEMBER TO CONDUCTIVE PART OF MEMBER IN MOLDED ARTICLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of a metal member to the conductive part of the member in a molded article capable of easily performing production and having no fear generating the connection inferiority between the conductive part and the metal member. SOLUTION: A flexible substrate 10 and a metal plate 20 are housed in a mold so that the metal plate 20 comes into contact with the conductive part 17 of the flexible substrate 10 and a molten molding resin is injected in the cavity of the mold and solidified to connect the conductive part 17 and the metal plate 20 within a molded article 30. In this case, by preliminarily providing a low m.p. metal material layer M melted at temp. lower than the melting temp. of the molded article 30 to the surface of the metal plate 20, the low. m.p. metal material layer M is melted at the time of the injection of the molten molding resin into the cavity to connect the metal plate 20 and the conductive part 17.
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申请公布号 |
JP2001001367(A) |
申请公布日期 |
2001.01.09 |
申请号 |
JP19990176779 |
申请日期 |
1999.06.23 |
申请人 |
TEIKOKU TSUSHIN KOGYO CO LTD |
发明人 |
INAGAKI JIRO;MITSUI KOJI |
分类号 |
H01L23/02;B29C45/14;B29K105/22;B29L31/34;(IPC1-7):B29C45/14 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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