| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition which has both the excellent characteristics and moldability of an aromatic polyamide resin and further has more excellent thermal aging resistance and moisture resistance than those of conventional aromatic polyamide resin compositions. SOLUTION: This thermal aging-resistant polyamide resin composition comprises 95.5 to 50 pts.wt. of a polyamide resin, 0.5 to 50 pts.wt. of a modified polyolefin, 0.05 to 2 pts.wt. of a trivalent phosphorous compound, and 0.05 to 5 pts.wt. of an alkyl-substituted phenolic compound of the formula (R1 is a divalent group having at least one ester bond, amide bond or ether bond in the main chain; R2 to R5 are each independently an alkyl group). Therein, the total amount of the polyamide resin and the modified polyolefin is 100 pts.wt. The polyamide resin is produced from an aromatic dicarboxylic acid, an aliphatic dicarboxylic acid, a heterocyclic diamine and an aliphatic diamine, and has a relative viscosity of 1.5 to 5.0 measured in 20 deg.C concentrated sulfuric acid.
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