| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition which is excellent in heat-resistance, mechanical properties, low-hygroscopicity, adhesiveness, moldability and low dielectric constant by blending (A) a copolymer obtained by polycondensation of (a) a quinoline monomer and a bispyroindan monomer, and (B) an organic solvent. SOLUTION: For the component a, 2(2-fluorophenyl)-5-fluoro-4-phenylquinoline, for example, is used. For the component b, 6,6'-dihydroxy-3,3,3',3'- tetramethylphenyl-1,1'-bispyroindan, for example, is used. Polycondensation is carried out by blending the component a and the component b in the molar ratio (the component a/the component b) of 0.9-1.2 and reacting them in the presence of an organic solvent for 0.5-48 hr at 100-300 deg.C with a catalyst such as sodium hydroxide and the like to obtain the component A (having a weight average molecular weight of 1,000-100,000). Methyl Cellosolve, for example, is used for the component B. The content of the component B to be used is such that the solid component concentration of the component A be 1-60 wt.%.
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