发明名称 THERMOFORMING OF THERMOSETTING RESIN-CONTAINING MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for thermoforming of a thermosetting resin- containing molding material without dispersion of thickness size in a completed molded product by reducing the extent of spring back to the minimum regardless of the individual difference. SOLUTION: A thermoforming apparatus 1 is equipped with a thickness detecting means 15 for detecting the thickness of a molded product in a thermoforming metal mold. Treating conditions such as temperature, pressure and pressurizing time are initially suitably set at the time of carrying out a thermoforming treatment to perform the standard thermoforming treatment for forming a thermosetting resin-containing molding material 3 into a target thickness size. A spring back detecting treatment for releasing the molding pressure and detecting a change in the thickness size of the molded product by spring back with the thickness detecting means 15 and a repressurizing treatment for resetting the treating conditions such as the temperature, pressure and pressurizing time based on the extent of the spring back detected in the spring back detecting treatment are then carried out.
申请公布号 JP2001002795(A) 申请公布日期 2001.01.09
申请号 JP19990175613 申请日期 1999.06.22
申请人 AKEBONO BRAKE IND CO LTD 发明人 KAWANISHI NAOZUMI;WAKABAYASHI YUTAKA;YUMOTO TAKEO;SUGANO TAKASHI;KASUYA HIROSHI
分类号 C08J5/14;F16D69/00;(IPC1-7):C08J5/14 主分类号 C08J5/14
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