| 摘要 |
PURPOSE: A structure of a free-space optical interconnection module is provided to improve a heat emission characteristic in a free-space optical interconnection module. CONSTITUTION: A structure of a free-space optical interconnection module comprises an optical transmission module(10) and an optical reception module(20). The optical transmission module(10) comprises the first copper substrate(11), a surface emission laser array(12), a laser array drive circuit(13), the first interconnection wiring(14), and the second interconnection wiring(15). The optical reception module(20) comprises the second copper substrate(21), an optical detection array(22), an optical receiving circuit(23), the third interconnection circuit(24), and the fourth interconnection circuit(25).
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