| 摘要 |
The invention concerns a method for electrically separating metal contacts (3) from module support films (1) for chip cards, whereby said metal contacts are electrically separated by cutting the metal without perforating the dielectric bearing them. The metal may be cut for example by continuous or alternate sawing, or by a technique selected among cutting processes with laser, electrical discharge machining, shearing, mechanical pinch or electrical backfire, or by any combination of those techniques. The invention is useful for testing assemblies for chip cards.
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