| 摘要 |
PURPOSE: An apparatus for molding a lead gull form of a semiconductor package is provided to maximumly control a defective proportion of an expensive semiconductor chip, by actively and synchronously making a variable pin move up while continuously and fixedly supporting a semiconductor package even if the semiconductor package becomes bent. CONSTITUTION: An apparatus for molding a lead gull form of a semiconductor package comprises an upper die and a lower die. The upper die includes an upper holder, an upper housing, a stripper and a gull form punch. The lower die includes a die pad(411) and a revolving bracket(430). The die pad having a plurality of fixing pins(413) is established in a die holder. The revolving bracket revolves by a hinge(431) in a fixing holder, and lead-forms a semiconductor package by a pusher when the upper die descends. A variable pin(470) is installed to be protruded in a plurality of two-stage penetration holes(441), moving up and down. A variable pin fixing unit for fixing the variable pin right before a lead is gull-formed by a gull forming roller(432), is installed in the upper die.
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