发明名称 MEMORY MODULE USING A MEMORY DEVICE HAVING A DEFECT
摘要 PURPOSE: A memory module using a memory device having a defect is provided to reduce a manufacturing cost without affecting an operation or performance of the memory module, by reusing a product having the defect in data lines of the memory device for an error correction code(ECC). CONSTITUTION: A memory module using a memory device having a defect comprises a printed circuit board(PCB), four dynamic random access memory(DRAM) devices and a DRAM device for an error correction code(ECC). The PCB includes a pattern for forming a memory module and a pattern for processing eighty data lines. The four DRAM devices are mounted on the PCB, and form the memory module for inputting/outputting 64 real data. The DRAM device for the ECC is mounted on the PCB, using only 8 data lines out of 16 data lines. The DRAM device for the ECC uses the DRAM device having the defect in upper or lower 8 data lines out of the 16 data lines.
申请公布号 KR20010001342(A) 申请公布日期 2001.01.05
申请号 KR19990020489 申请日期 1999.06.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, HWA JIN;SEO, SEUNG JIN
分类号 H01L27/10;(IPC1-7):H01L27/10 主分类号 H01L27/10
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