| 摘要 |
PURPOSE: A method and device for inspecting error in a wafer is provided to rapidly and accurately perform a first error inspection by automating the error inspection by a surface color of the wafer. CONSTITUTION: A device for inspecting error in a wafer includes a supporter(14) for supporting a wafer(12), a light source(10) for illuminating light on a wafer surface laid on the supporter, image pick-up means(16) for collecting light reflected from the wafer surface and picking up color image of the wafer surface, an analog-digital converter(18) for receiving color image signal from the image pick-up means and converting into digital data, a data processor(20) for processing digital data to comparison data, a database(24) embodying reference data corresponding to reference color image of the wafer surface according to material and thickness of a thin film formed on the wafer, determining means(22) for comparing comparison data of the data processor and reference data embodied in the database and determining error, and a display for displaying reference data corresponding to comparison data.
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