METHOD FOR BACK-GRINDING A WAFER, A SEMICONDUCTOR PACKAGE USING THE SAME AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package using a method for back-grinding a wafer is provided to easily handle the semiconductor package and to reduce a manufacturing cost, by making the semiconductor package in a wafer level. CONSTITUTION: A semiconductor package using a method for back-grinding a wafer comprises a semiconductor chip(4), a circuit board(10), an adhesive(20), an electrical connection unit(30), an encapsulating material(50) and a plurality of conductive balls(40). A plurality of input/output pads(2) are formed on a surface of the semiconductor chip. The circuit board is established in a position of the surface on which the input/output pads of the semiconductor chip are formed, having a conductive circuit pattern layer composed of a plurality of bond fingers(12) and ball lands(13), and including a penetration hole(15) in a position corresponding to the input/output pad. The adhesive surrounds a side of the semiconductor chip while adhering the surface of the semiconductor chip to the circuit board. The encapsulating material encapsulates the input/output pads, the connection unit and the periphery of the penetration hole of the circuit board. The plurality of conductive balls are melted and adhered to the ball land of the circuit board, used as input/output terminals.