| 摘要 |
PURPOSE: A chip stack ball grid array package, as well as a manufacturing method therefor, is provided to realize a thinner package, more input/output terminals, and better productivity. CONSTITUTION: For a chip stack ball grid array package, two semiconductor chips(21,22) are provided facedown to a circuit substrate(10). The second chip(22) smaller than the first chip(21) is sandwiched between the first chip(21) and the circuit substrate(10). The circuit substrate(10) has a plurality of slot holes(11) through which circuitry patterns(3) on the substrate(10) are electrically connected to the first and second chips(21,22) by wires(4). The wire-connected portions are sealed with resin compound(5). Additionally, a plurality of solder balls(6) are provided as input/output terminals to the circuit substrate(10).
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