SEMICONDUCTOR PACKAGE CLAD MATERIAL AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A semiconductor package clad plate and a semiconductor package that can be produced at low cost and that have good characteristics. To this end, the clad material (33) is characterized by comprising Cu layer / Mo layer / Cu layer with a nickel layer (21) interposed to serve as an etching stopper layer (12). Further, the semiconductor package is produced such that a Cu layer (22) and a copper foil (24) are laminated on the clad material (33) and pressed to form a semiconductor package clad plate (34), which is selectively etched to form a window frame (17), to which a semiconductor chip (1) and a printed board (10) are attached.