发明名称 PHOTOSENSITIVE LOW-PERMITTIVITY POLYIMIDE AND METHOD OF FORMING POSITIVE POLYIMIDE FILM PATTERN FROM THE SAME
摘要 <p>A photosensitive low-permittivity polyimide for use in applications where a low permittivity is required, such as interlayer dielectrics in semiconductor devices. The polyimide is a solvent-soluble polyimide which has positive photosensitivity in the presence of a photo-acid generator. It is obtained by the polycondensation of at least one aromatic tetracarboxylic dianhydride and at least one mainly aromatic diamine, wherein at least either of the at least one aromatic tetracarboxylic dianhydride and the at least one diamine as components of the polyimide contains a fluorine atom and/or the diamine comprises benzidine or a derivative thereof and/or a fluorene derivative. It has a specific permittivity of 2.90 or lower.</p>
申请公布号 WO2001000710(P1) 申请公布日期 2001.01.04
申请号 JP2000004173 申请日期 2000.06.26
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