发明名称 Halbleiterspeicher-Chipmodul
摘要 The invention relates to a semiconductor memory chip module (2') for a chip card, in which a non-volatile memory chip (EEPROM) (4) and a volatile memory chip (SRAM) (6) are stacked on top of each other and directly coupled with each other by vertical intermediate chip connections (16). The volatile memory with quick access enables programmes to be processed rapidly. Data can be stored permanently and securely through transfer to the non-volatile memory. A chip (8) with decoding circuits can be contained at a further level. A buffer capacitor (20) is also incorporated in a chip and is recharged to a constant supply voltage during operation.
申请公布号 DE19928733(A1) 申请公布日期 2001.01.04
申请号 DE1999128733 申请日期 1999.06.23
申请人 GIESECKE & DEVRIENT GMBH 发明人 GRASL, THOMAS
分类号 G11C5/06;G06K19/073;G06K19/077;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L25/065 主分类号 G11C5/06
代理机构 代理人
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