Production of a semiconductor wafer used as the base material for a semiconductor component comprises removing the semiconductor from a single crystal, processing by ductile chip removal, and polishing and cleaning the surface

摘要

Production of a semiconductor wafer comprises removing the semiconductor from a single crystal, processing the semiconductor wafer surface by ductile chip removal, and polishing and cleaning the surface. Preferred Features: The processing of the semiconductor wafer surface is carried out by ductile chip removal as well as on the front and rear sides.