发明名称 HOT MELT PRESSURE SENSITIVE POSITIONING ADHESIVE (II)
摘要 <p>The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive contains from 6 to less than 15 percent by weight of a selectively hydrogenated block copolymer of styrene and (butadiene and/or isoprene) and styrene (e.g. styrene-ethylene/butylene styrene -SEBS; or styrene-ethylene/propylene styrene -SEPS) in blend with a selectively hydrogenated styrene-isoprene-styrene-isoprene block copolymer (styrene-ethylene/propylene-styrene-ethylene/propylene - SEPSEP) and, optionally, an amorphous ethylene/propylene copolymer. The blend comprises at least 6 wt.% if the total of blend, tackifying resin and plasticizer.</p>
申请公布号 WO2001000256(A1) 申请公布日期 2001.01.04
申请号 EP2000005901 申请日期 2000.06.23
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