COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

A substrate (1) is provided with a mainly copper layer (2). A wire (3) is joined to the copper layer (2) by means of bonding and by formation of an intermetallic compound, whereby a hard layer (5) which is applied to the mainly copper layer (2) is broken up in the bond area. The hard layer is stable at a temperature of at least 80 DEG C. At this temperature said layer acts as an oxygen diffusion barrier, acting upon aluminium in a manner similar to an aluminium oxide layer which is formed in a normal environment.