| 摘要 |
A wafer polishing head comprises a body portion 40, a wafer carrier 20 and a retainer ring 30, the wafer carrier 20 and the retainer ring 30 being movable relative to each other and to the body portion 40 by means of air bags 51 and 61, wherein the air bag 51 for moving the wafer carrier 20 is arranged around the outer periphery of the body portion 40 and the air bag 61 for moving the retainer ring 30 is arranged at the central portion of the head body 40. The air bags 51 and 61 may be made from rubber sheet. |
