发明名称 Semiconductor device having a passivation layer which minimizes diffusion of hydrogen into a dielectric layer
摘要 A semiconductor device forming a capacitor through an interlayer insulating layer on a semiconductor substrate on which an integrated circuit is formed. This semiconductor device has an interlayer insulating layer with moisture content of 0.5 g/cm3 or less, which covers the capacitor in one aspect, and has a passivation layer with hydrogen content of 1021 atoms/cm3 or less, which covers the interconnections of the capacitor in other aspect. By thus constituting, deterioration of the capacitor dielectric can be prevented which brings about the electrical reliability of the ferroelectric layer or high dielectric layer.
申请公布号 US6169304(B1) 申请公布日期 2001.01.02
申请号 US19980071534 申请日期 1998.05.04
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ARITA KOJI;FUJII EIJI;SHIMADA YASUHIRO;UEMOTO YASUHIRO;NASU TORU;MATSUDA AKIHIRO;NAGANO YOSHIHISA;INOUE ATSUO;MATSUURA TAKETOSHI;OTSUKI TATSUO
分类号 H01L21/02;H01L21/8242;H01L21/8246;H01L27/115;(IPC1-7):H01L29/76;H01L27/108;H01L29/00;H01L23/58 主分类号 H01L21/02
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