| 摘要 |
A method of grinding a microelectronic device includes a step of preparing an abrasive member by crushing a solid-phase liquid into massive form and by compacting the crushed solid-phase liquid, an abrasive member by compacting a solid-phase gas, or an abrasive member by crushing a solid-phase liquid into massive form, by mixing the crushed solid-phase liquid with a solid-phase gas and by compacting the mixed solid-phase liquid and solid-phase gas, and a step of pressing a surface of the microelectronic device to be ground against the abrasive member.
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