发明名称 Method for fabricating semiconductor device
摘要 Disclosed is a semiconductor device having low voltage characteristic and advantageous integrity simultaneously. The semiconductor device comprises a silicon-on-insulator (SOI) substrate of a stack structure comprising a base layer as a means for supporting, a buried oxide layer, and a semiconductor layer providing an active region; and a first transistor and a second transistor formed on the active region of the SOI substrate, wherein the first and second transistors are formed as a stack structure on one active region and they share one gate electrode, a drain region of the second transistor is electrically connected to the gate electrode and a source region of the second transistor is electrically connected to the active region.
申请公布号 US6168979(B1) 申请公布日期 2001.01.02
申请号 US19990348572 申请日期 1999.07.07
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 KIM HYUNG KI;LEE JONG WOOK
分类号 H01L21/31;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L29/72 主分类号 H01L21/31
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