MULTIPLE LAYER PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURE

摘要

A printed circuit board (10) and method of manufacture thereof is disclosed. The printed circuit board (10) includes a first substrate provided from a conductive layer (12) having disposed on a first surface (12a) thereof a cured adhesive layer (14). A semi-cured adhesive layer (16) is then disposed over the cured adhesive layer (14) and a second substrate (18) is disposed against the semi-cured adhesive layer (16).