Method for enhancing the reliability of a dielectric layer of a semiconductor wafer

摘要

The present invention provides a method for enhancing the reliability of a dielectric layer of a semiconductor wafer. The dielectric layer is formed above a silicon element. First, the method implants argon ions with a dosage of around 1015~1016 ions/cm3 and an energy of around 3~50 KeV into the silicon element to form an ion implantation layer. Then, the dielectric layer is formed on a predetermined area of the silicon element. The ion implantation layer prevents oxygen ions, impurities and charge carriers from converging on the surface of the silicon element so as to enhance the reliability of the dielectric layer.