发明名称 Module jack arrangement
摘要 A module jack arrangement, which includes multiple module jacks coupled into a row, and at least one clip respectively installed in each two adjacent module jacks to secure the module jacks in position, each module jack including a housing, a terminal holder fastened to the housing and holding a set of terminals, wherein the housing has two coupling tongues and two coupling flanges disposed at two opposite sides at different elevations for enabling the housings two module jacks to be coupled together, and two coupling grooves at two opposite sides for receiving the respective clip; the terminal holder has two vertical coupling flanges bilaterally disposed in reversed directions for enabling the terminal holder of one module jack to be coupled to the terminal holder of another, and a hooked flange for engagement with a hooked flange in the housing of the respective module jack.
申请公布号 US6168461(B1) 申请公布日期 2001.01.02
申请号 US19990467010 申请日期 1999.12.20
申请人 TECKON ELECTRONICS CORP. 发明人 CHANG CHIH-KAI
分类号 H01R9/24;(IPC1-7):H01R13/60 主分类号 H01R9/24
代理机构 代理人
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