发明名称 |
High density substrate and methods for manufacturing same |
摘要 |
This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits, interposers, and other electronic laminates. |
申请公布号 |
AU5485400(A) |
申请公布日期 |
2001.01.02 |
申请号 |
AU20000054854 |
申请日期 |
2000.06.14 |
申请人 |
ALLIED-SIGNAL INC. |
发明人 |
GORDON SMITH;JEFFREY T. GOTRO;MARC HEIN;NANCY M. W. ANDROFF |
分类号 |
H05K1/09;B32B15/08;H05K3/00;H05K3/02;H05K3/06;H05K3/18;H05K3/42 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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