| 摘要 |
Apparatuses are disclosed for use in dispensing a process liquid onto a surface of a wafer. The apparatus may include a bowl having a bottom and a side defining an interior region. An air ring is disposed in the interior region to define an upper plenum in fluid communication with a lower plenum. The air ring may have at least one flow path therethrough to said lower plenum, preferably in the form of a plurality of holes in a circumferential groove. Also in a preferred embodiment, a top ring is provided to further define the upper plenum. A semiconductor wafer that has a liquid dispensed thereon, may be supported within the bowl to contact portions of the air ring to remove excess liquid migrating to the underside of the wafer. The excess liquid may be drained through the air ring into the lower plenum wherein it is removed by a drain. A solvent dispenser may be provided in the air ring to apply a solvent to the underside of the wafer. Excess solvent and liquid may be drained through the air ring to the lower plenum.
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