发明名称 Thermosetting resin potting composition
摘要 The present invention provides a thermosetting resin potting composition with low melt viscosity and good flowability even though it contains large amount of an inorganic filler containing sphere silica powder as a main component. With this construction, the present invention has solved the problem residing in the prior art that, when the content of an inorganic filler is increased, the viscosity of a potting composition is increased and its flowability is lowered.In the present invention, the sphere silica particles in the inorganic filler have at least one particle group, and the particle group has an average particle diameter of 0.01 to 10 mum and a coefficient of particle diameter variation of 10 percent or smaller. More preferably, the sphere silica particles have two or more particle groups. In this case, the average particle diameter of the larger particle group is 1.4 times or larger than that of its adjacent and smaller particle group.
申请公布号 US6169136(B1) 申请公布日期 2001.01.02
申请号 US19980134564 申请日期 1998.08.14
申请人 NIPPON SHOKUBAI CO., LTD. 发明人 IRIGUCHI JIRO;YAMAMOTO YASUHIRO;OISHI HIDEKI;SHIMIZU SHUJI
分类号 C08K3/36;C08K7/18;C08L87/00;C08L101/00;H01L23/29;H01L23/31;(IPC1-7):C08K3/00 主分类号 C08K3/36
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