发明名称 |
Two chamber plasma processing apparatus |
摘要 |
A plasma processing apparatus has a plurality of annular permanent magnets arranged concentrically of a polarity identical in the circumferential direction at the atmosphere side of a second electrode arranged opposite to a stage on which an object to be processed is placed. Arrangement is provided so that the polarity of magnets located adjacent radially is opposite. An insulation substrate is provided between a partition panel and a processing chamber to electrically insulate a plasma generation chamber. Direct current voltage is applied in a pulsive manner to the plasma generation chamber. Thus, a plasma processing apparatus can be provided that allows formation of plasma uniformly over a large area, and processing of a specimen of a large diameter uniformly.
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申请公布号 |
US6167835(B1) |
申请公布日期 |
2001.01.02 |
申请号 |
US19980047935 |
申请日期 |
1998.03.26 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OOTERA HIROKI;TAKI MASAKAZU;SHINTANI KENJI;NISHIKAWA KAZUYASU |
分类号 |
H05H1/46;C23C16/50;C23C16/515;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):C23C16/00 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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