发明名称 Two chamber plasma processing apparatus
摘要 A plasma processing apparatus has a plurality of annular permanent magnets arranged concentrically of a polarity identical in the circumferential direction at the atmosphere side of a second electrode arranged opposite to a stage on which an object to be processed is placed. Arrangement is provided so that the polarity of magnets located adjacent radially is opposite. An insulation substrate is provided between a partition panel and a processing chamber to electrically insulate a plasma generation chamber. Direct current voltage is applied in a pulsive manner to the plasma generation chamber. Thus, a plasma processing apparatus can be provided that allows formation of plasma uniformly over a large area, and processing of a specimen of a large diameter uniformly.
申请公布号 US6167835(B1) 申请公布日期 2001.01.02
申请号 US19980047935 申请日期 1998.03.26
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OOTERA HIROKI;TAKI MASAKAZU;SHINTANI KENJI;NISHIKAWA KAZUYASU
分类号 H05H1/46;C23C16/50;C23C16/515;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):C23C16/00 主分类号 H05H1/46
代理机构 代理人
主权项
地址