发明名称 |
Chemical-mechanical polishing slurry that reduces wafer defects |
摘要 |
A method of making a chemical-mechanical polishing slurry includes mixing a ferric salt oxidizer with a solution to produce a mixture with a dissolved ferric salt oxidizer, filtering the mixture to remove most preexisting particles therein that exceed a selected particle size, adding a suspension agent to the mixture, and adding abrasive particles to the mixture after filtering the mixture. Advantageously, when polishing occurs, scratching by the preexisting particles is dramatically reduced.
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申请公布号 |
US6168640(B1) |
申请公布日期 |
2001.01.02 |
申请号 |
US19990280391 |
申请日期 |
1999.03.29 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BURKE PETER A.;BECKAGE PETER J. |
分类号 |
C09G1/02;C09K3/14;(IPC1-7):C09K3/14;B24B1/00 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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