| 发明名称 |
Single strip moulding apparatus with means for exerting pressure |
| 摘要 |
<p>Electronic components, chips, are moulded in a single-strip moulding apparatus. The products to be moulded are placed in a mould consisting of two halves, one of the halves whereof displays recesses for receiving a component, which half is connected via a channel with a cavity for receiving a quantity of moulding material. After use the mould must be cleaned and the moulded product carried away. This is carried out by a cleaning-discharge unit combined into a unit.</p> |
| 申请公布号 |
HK1015129(A1) |
申请公布日期 |
2000.12.29 |
| 申请号 |
HK19980115278 |
申请日期 |
1998.12.23 |
| 申请人 |
FICO B.V. |
发明人 |
JOHANNES LAMBERTUS GERARDUS MARIA VENROOIJ;WOUTER BASTIAAN VERWOERD |
| 分类号 |
B29C31/06;B29C31/08;B29C33/22;B29C33/24;B29C33/72;B29C37/00;B29C43/02;B29C43/34;B29C45/02;B29C45/14;B29C45/42;B29C45/66;B29C45/67;B30B1/10;B30B1/32;B30B15/00;H01L21/00;(IPC1-7):B30B;B29C |
主分类号 |
B29C31/06 |
| 代理机构 |
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代理人 |
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