| 摘要 |
The invention relates to a semiconductor component comprising a housing, a substrate board, at least one ceramic substrate which at least on its upper surface is provided with a metallization (10), and at least two switching elements. The switching elements are mounted on the upper surface of the ceramic substrate in an electrically conductive manner and each have load-current connections and a control connection. According to the invention the semiconductor component comprises several external load-current connecting elements which are positioned on one side of said component as well as on a second side which is opposite the first. The load-current connections of the switching elements are electrically connected via supply wires to the external load-current connecting elements which can present a first and a second supply potential. Two switching elements each are arranged next to each other in such a way that the corresponding supply wires extend substantially parallel to two load-current connecting elements which are assigned to same and present different polarities. This results in compensation of the magnetic fields. |
