| 摘要 |
<p>A reworkable underfilling sealing mateiral (33) for the attachment of a semiconductor device (32) to a carrier substrate (31) is prepared from a composition comprising a curable resin (a) which is a resin with a (thio)ether or carbonate core structure and a heteroatom-containing carbocyclic structure, an epoxy resin having at least one alkylene oxide residue, or an epoxy resin with a monepoxide (thio)ester or carbonate coreactant diluent; and (b) a curing agent including a polyamine, an epoxy- or novolac-modified amine, an amide compound or an imidazole; optionally with an anhydride.</p> |
