发明名称 |
Method of modifying a surface of a structured wafer |
摘要 |
A method of modifying a surface comprising the steps of: (a) contacting the surface to be modified with a working surface of an abrasive article, the abrasive article comprising a phase separated polymer having a first phase and a second phase, the first phase being harder than the second phase; and (b) relatively moving the surface to be modified and the fixed abrasive article to remove material from the surface to be modified in the absence of an abrasive slurry. |
申请公布号 |
AU1317500(A) |
申请公布日期 |
2000.12.28 |
申请号 |
AU20000013175 |
申请日期 |
1999.10.18 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
DANIEL B. PENDERGRASS JR. |
分类号 |
B24B37/24;B24D3/20;B24D11/00;C08J5/14;C09K3/14;H01L21/304 |
主分类号 |
B24B37/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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