| 摘要 |
By using a clad technique and adopting a bare chip mount system using an anisotropic conductive adhesive in a connection system of electronic parts, a solder reflow process becomes unnecessary. Thus, there is provided a process for producing a clad plate for printed wiring board, an IC card and a printed wiring substrate, which makes it possible to use an inexpensive material such as PET and can produce the printed wiring board at low cost. Therefore, the printed wiring board forms a clad plate (31) for the printed wiring board, which has a laminated structure, by pressure-bonding a bump forming foil (13) made of a copper foil material to one side face of a circuit forming foil (11) made of the copper foil material through an etching stop layer (12) made of a nickel foil material or a nickel plating, and a resin film (17) such as PET is bonded to the other side face of the clad plate (31) for the printed wiring board. |
