Wafer polishing head for polishing semiconductor wafers relying upon a chemical-mechanical polishing (CMP) method, has wafer carrier being moved relative to retainer ring and to body portion

摘要

The head includes holder head with head body (40) that rotates and is arranged opposed to polishing table (4), a wafer carrier (20) loosely supported by the head body, and a retainer ring (30) supported by the head body arranged along the outer periphery of the carrier concentric with it so as to surround the periphery of the wafer (2) at time of polishing. The polishing table has a polishing pad (3) stretched on the upper surface to polish the semiconductor wafer, and a holder head (10) that holds the wafer, pushes it to the polishing pad with a predetermined force and rotates. A drive unit rotates head body. Wafer carrier has air blowing member that forms a pressurized air layer relative to the wafer and transmits a pushing force to the wafer through the air layer.