Completing pressure sensor by injection-molding around sensor assembly, is assisted by clamping lead frame mounting section in injection mold during injection of casing

摘要

The mounting section (12) of the lead frame is clamped in the injection mold (40) during production of the casing. An Independent claim is included for the pressure sensor. The extended region (13) of the mounting section (12) of the lead frame (10) is not embedded in injected mass, and extends out to the side from the casing (30) of the pressure sensor. Preferred features: From the populated region of the semiconductor pressure receiver, an extended region (13) of the mounting section (12), projects out to one side. It is clamped between the two halves (41, 42) of the injection mold (40). Mold halves make contact on the upper and lower sides of the mounting section. A pressure channel (27) constructed in the mounting section below the semiconductor pressure receiver (2), is covered by the mold. The entire lower surface (15) of the mounting section facing away from the pressure receiver is covered by the mold half (42).