WIRING SUBSTRATE FOR CONDUCTIVE CONTACT UNIT

摘要

A wiring substrate for a conductive contact unit on which highly precise conductive paths can be formed. A wiring substrate (5) with which a plurality of needle-shaped bodies (4a) of a conductive contact unit (1) used for inspecting a liquid crystal panel (2) are brought into contact is fabricated by arranging conductive paths on a glass substrate. On an end of each conductive path, a pad for a contact is formed, while on the other end, an FPC (6) for external connection is connected. Since a plurality of conductive paths can be formed with fine pitches on a glass substrate, the wiring substrate is hardly influenced by thermal expansion due to temperature difference in contrast to, e. g., a TAB where conductive paths are formed on a film. The miniaturization of the conductive paths are maintained and suitably adaptable to miniaturization of an object to be inspected. Since the shapes of the conductive paths can be freely designed, various patterns can be formed, and the wiring substrate is adaptable to various inspection objects.