发明名称 METHOD FOR PRODUCING CIRCUIT-FORMING BOARD, CIRCUIT-FORMING BOARD, AND CARBON SHEET
摘要 A method for producing a circuit-forming board by inserting a graphite sheet (1) having a good heat conductivity in the board without electrically connecting the sheet (1) to a conductive hole (6) thereby to prevent the temperature of the heat-generating devices and board from increasing, comprising preparing a heat-dissipating sheet (7) produced by applying resin (2) to a graphite sheet (1), making a sheet hole (3) in the heat-dissipating sheet (7), and fabricating a core (10) by joining an insulating material to the heat-dissipating sheet (7) having the hole (3) by thermocompression bonding.
申请公布号 WO0079848(A1) 申请公布日期 2000.12.28
申请号 WO1999JP03291 申请日期 1999.06.21
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;KOBAYASHI, TAKASHI;OKA, SEIJI;FUNAHASHI, KAZUO;TSURUSE, HIDEKI 发明人 KOBAYASHI, TAKASHI;OKA, SEIJI;FUNAHASHI, KAZUO;TSURUSE, HIDEKI
分类号 H05K1/02;H05K1/05;H05K3/42;H05K3/46;(IPC1-7):H05K1/02;H05K3/00;H05K1/03 主分类号 H05K1/02
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