发明名称 |
METHOD FOR PRODUCING CIRCUIT-FORMING BOARD, CIRCUIT-FORMING BOARD, AND CARBON SHEET |
摘要 |
A method for producing a circuit-forming board by inserting a graphite sheet (1) having a good heat conductivity in the board without electrically connecting the sheet (1) to a conductive hole (6) thereby to prevent the temperature of the heat-generating devices and board from increasing, comprising preparing a heat-dissipating sheet (7) produced by applying resin (2) to a graphite sheet (1), making a sheet hole (3) in the heat-dissipating sheet (7), and fabricating a core (10) by joining an insulating material to the heat-dissipating sheet (7) having the hole (3) by thermocompression bonding. |
申请公布号 |
WO0079848(A1) |
申请公布日期 |
2000.12.28 |
申请号 |
WO1999JP03291 |
申请日期 |
1999.06.21 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;KOBAYASHI, TAKASHI;OKA, SEIJI;FUNAHASHI, KAZUO;TSURUSE, HIDEKI |
发明人 |
KOBAYASHI, TAKASHI;OKA, SEIJI;FUNAHASHI, KAZUO;TSURUSE, HIDEKI |
分类号 |
H05K1/02;H05K1/05;H05K3/42;H05K3/46;(IPC1-7):H05K1/02;H05K3/00;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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