| 摘要 |
A method of forming metal enclosures (1) specifically for electrical or electronic components which require precision in the formation of enclosure wells (20) for containing the components. In accordance with the present invention the method comprises the steps of initially taking a metal blank (1) having a depth thickness at least sufficient to accommodate a pre-determined enclosure well depth therein; determining the shape and depth of varying dimensions of the predetermined enclosure well; using a coining press and dies to separately cold from the determined shapes and depths (2, 2') which in toto form the desired well (20), and wherein each of the cold forming causes extrusion of a portion of metal (2a, 2a') to extend beyond the original depth thickness; after each cold forming with the coining press of the separate shapes and depth, using a metal removal device such as a grinder to remove the metal extrusion portion (2a, 2a').
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