| 摘要 |
An EMI/RFI shield, using very thin conductive film (250) for attachment to a plastic part (12), prepared by a process comprising the steps of creating a two dimensional representation of a surface of the plastic part (12) which is to be shielded, creating at least one pattern (254, 256) corresponding to a portion of the representation of the surface to be shielded, incising the patterns (254, 256) into conductive foil material (250) to create foil pattern parts (14, 16), detaching the foil pattern parts (14, 16) from surrounding foil material (60), shaping the foil pattern parts (14, 16) into shaped foil parts (270, 272) and attaching the shaped foil parts (270, 272) to the plastic part (12) by use of an expandable fabricating device (100), which during expansion acts to press the shaped foil part (270, 272) to the plastic part (12). A second preferred embodiment of the present invention (100) is an apparatus for installing thin metallic film (250) shielding with plastic parts (12) to create EMI/RFI shields (10), including an expandable mechanical device (100), which is expandable by activation of at least one device (100, 120) which is operated pneumatically, hydraulically or by solenoid devices. A method of manufacture is also disclosed for creating EMI/RFI shields (10).
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