| 摘要 |
The invention concerns a method for making an electronic device, comprising at least an electronic and/or an electric circuit. The invention is characterised in that all or part of said circuit is produced by jet spraying drops of material. More particularly, the invention concerns a method for making a portable integrated circuit electronic device, by transferring an integrated circuit chip (10) onto a support film (15) provided with connection pads (18). The invention is characterised in that the connection between the bump contacts (11) of the chip (10) and the connection pads (18) of the support film (15) is produced by jet spraying a conductive material (50). |
