发明名称 |
Pressure sensor device for acting as a fixing structure for a sensor module includes a sensor element fitted on the surface of a sensor module and a groove area formed in an upper or lower casing. |
摘要 |
A wall area (15a) to include a sensor element (13) fits on the surface of a sensor module (9). A groove area (10a) corresponding to the wall area is formed in an upper (11) or lower (6) casing. One end of the wall area is joined to the groove area by an adhesive to form a closed space for accepting the sensor element.
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申请公布号 |
DE19961776(A1) |
申请公布日期 |
2000.12.21 |
申请号 |
DE19991061776 |
申请日期 |
1999.12.21 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
NISHIMURA, ETSUO;NAKAMURA, HIROSHI |
分类号 |
G01L19/00;G01L9/00;G01L9/04;H01L29/84;(IPC1-7):G01L9/04;H01L49/00 |
主分类号 |
G01L19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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