发明名称 |
LOW-INDUCTANCE SEMICONDUCTOR COMPONENT |
摘要 |
The invention relates to a semiconductor component comprising a housing, a substrate board, at least one ceramic substrate which at least on its upper surface is provided with a metallization (10), and at least two switching elements. The switching elements are mounted on the upper surface of the ceramic substrate in an electrically conductive manner and each have load-current connections and a control connection. According to the invention the semiconductor component comprises several external load-current connecting elements which are positioned on one side of said component as well as on a second side which is opposite the first. The load-current connections of the switching elements are electrically connected via supply wires to the external load-current connecting elements which can present a first and a second supply potential. Two switching elements each are arranged next to each other in such a way that the corresponding supply wires extend substantially parallel to two load-current connecting elements which are assigned to same and present different polarities. This results in compensation of the magnetic fields. |
申请公布号 |
WO0077827(A2) |
申请公布日期 |
2000.12.21 |
申请号 |
WO2000DE01254 |
申请日期 |
2000.04.20 |
申请人 |
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH & CO. KG;HIERHOLZER, MARTIN |
发明人 |
HIERHOLZER, MARTIN |
分类号 |
H01L23/538;H01L25/07;H01L25/18 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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