| 摘要 |
<p>The invention concerns a method for making a device comprising a support associated with at least a microcircuit in the form of a chip, and comprising, for the or each chip, the following steps which consist in: a) first providing for said chip an assembly consisting of a thin chip maintained by one first surface to a protective substrate and having on said first surface at least a bond pad (8); b) transferring said assembly onto a surface (16a) of the support, with a second surface of the chip opposite the first, facing said support surface; c) removing the protective surface so as to expose said chip first surface; and d) producing at least part of a communication interface covering the chip first surface at the level of at least a bond pad and a surface portion (16a) of the support.</p> |
